Tool for automating roughness/step height calculations from AFM measurements of wafer surfaces for hybrid bonding
-
Updated
May 3, 2024 - Python
#
hybrid-bonding
Here are 2 public repositories matching this topic...
True 3D Global Placement GUI Viewer -- An interactive 3D visualization demo for 3D IC placement. Built for the era of Huawei's Tao (τ) Law and Logic Folding, where 3D placement becomes the key enabler for next-generation chip density beyond Moore's Law.
threejs eda huawei 3d-visualization 3d-ic global-placement chip-design chiplet hybrid-bonding advanced-packaging logic-folding tau-law moore-law placement-viewer
-
Updated
May 26, 2026 - HTML
Improve this page
Add a description, image, and links to the hybrid-bonding topic page so that developers can more easily learn about it.
Add this topic to your repo
To associate your repository with the hybrid-bonding topic, visit your repo's landing page and select "manage topics."