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hisilicon-opensdk: bump to ff20187b (dv500 +6 source modules)#2209

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widgetii merged 1 commit into
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hi3519dv500-opensdk-bump
Jun 27, 2026
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hisilicon-opensdk: bump to ff20187b (dv500 +6 source modules)#2209
widgetii merged 1 commit into
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hi3519dv500-opensdk-bump

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Bumps the hisilicon-opensdk pin to openhisilicon #206 (ff20187b), which added the remaining DV500 source modules — mipi_tx, gfbg, cipher, km, otp, hardware_cryptodev.

The dv500 install uses an open_*.ko glob, so the firmware now ships all 59 open_*.ko (was 53). The bump is additive for the other hisilicon/goke chips (#206 only touched hi3519dv500 paths).

Validated locally: make BOARD=hi3519dv500_ultimate br-hisilicon-opensdk installs 59/59 modules incl. the 6 new ones. The full CI matrix confirms no regression to the other chips.

Pull openhisilicon #206, which adds the remaining DV500 source modules:
mipi_tx, gfbg, and the crypto subsystem (cipher/km/otp/hardware_cryptodev).
The dv500 install uses an open_*.ko glob, so the firmware now ships all 59
open_*.ko (was 53). Additive for the other chips — #206 only touched
hi3519dv500 paths.

Validated locally: `make BOARD=hi3519dv500_ultimate br-hisilicon-opensdk`
installs 59/59 modules including the 6 new ones.
@widgetii widgetii merged commit e76e034 into master Jun 27, 2026
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@widgetii widgetii deleted the hi3519dv500-opensdk-bump branch June 27, 2026 06:13
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